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DILB24P-223TLF

DILB24P-223TLF

manufacturer:
Amphenol Communications Solutions
Description:
CONN IC DIP SOCKET 24POS TINLEAD
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Product Details
Features:
Open Frame
Mfr.Part #:
DILB24P-223TLF
Stock:
558
Product Category:
IC Sockets
Contact Finish - Mating:
Tin-Lead
Contact Finish - Post:
Tin-Lead
Contact Finish Thickness - Mating:
100.0µin (2.54µm)
Contact Finish Thickness - Post:
100.0µin (2.54µm)
Contact Material - Mating:
Copper Alloy
Contact Material - Post:
Copper Alloy
Housing Material:
Polyamide (PA), Nylon
Mounting Type:
Through Hole
Number Of Positions Or Pins (Grid):
24 (2 X 12)
Operating Temperature:
-55°C ~ 125°C
Product Status:
Active
Termination:
Solder
Product Description